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Courses For Self Financed Electrical And Electronic Engineering ...

COURSES FOR SELF-FINANCED ELECTRICAL AND ELECTRONIC
ENGINEERING POSTGRADUATE PROGRAMS
EESM 501
CMOS VLSI Design
[3-0-0:3]
CMOS process and design rules; MOS device electronics; CMOS circuit and logic
circuit characterization and performance estimation; VLSI design and verification tools.
Project work will be centered on industry standard tools.
EESM 503
Analog IC Analysis and Design
[3-0-0:3]
Current sources, output stages, operational amplifiers, frequency response, feedback
analysis, stability and compensation, slew rate, advanced integrated-circuit design
techniques, analog VLSI building blocks.
EESM 504
Advanced Analog IC Analysis and Design
[3-0-0:3]
Noise analysis, advanced op-amp design techniques, analog VLSI building blocks,
multipliers, oscillators, mixers, phase-locked loops, A/D and D/A converters, passive
filter design, frequency scaling, active filter design. Backgrounds: ELEC 221 and ELEC
304 Exclusion: ELEC 504
EESM 505
Advanced Semiconductor Devices
[3-0-0:3]
Principles and characteristics of semiconductor devices found in state-of-the-art ICs.
Emphasis is on deep-submicron MOS device design, characterization and modeling.
Important issues such as short channel effects, high-field behavior, hot carrier effects,
reliability and device scaling for present and future technology will be covered. Exclusion:
ELEC 505
EESM 506
Semiconductor Devices for Integrated Circuit Designs
[3-0-0:3]
Review of MOSFET characteristics, device modeling for circuit simulation (SPICE
models), the BSIM MOSFET models, other semiconductor models, circuit model
parameter characterization, design guard-band and statistical modeling.
EESM 507
Microelectronics Fabrication Technology
[3-0-0:3]
Process technologies in IC fabrication: epitaxial growth; chemical-vapor and physical-
vapor deposition of films; thermal oxidation; diffusion; ion implantation; microlithography;
wet/dry etching processes; process integration of MOS and bipolar technologies;
introduction to electronic packaging. Exclusions: CENG 582, ELEC 507
EESM 508
IC Systems Design and Analysis
[3-0-0:3]
System definition, design and analysis of integrated circuit systems: mixed-signal
systems, low power systems, embedded systems, etc. System trade-offs; introduction
to system-on-chip (SOC) concepts and methodology; case studies.
EESM 509
IC Product Development Methodologies
[3-0-0:3]
Integrated circuit product development cycle; technology and foundry interfaces; yield
and cost improvement; design-in-manufacturability; design-in-quality; product
manufacturing logistics; IC debug methodology; case studies.
EESM 510
Photonics Technology and Applications
[3-0-0:3]
This course introduces the fundamentals of photonics, as well as provides a survey on
the frontiers of optics and photonics technology. Fundamental topics include: geometric
and wave optics, fiber optics, semiconductor light sources, and electro-optics. Selected
special topics include: biophotonics, micro and nano optics, photonic integrated circuits
and components, optical switching and RF photonics.
EESM 514
Digital Communication Networks and Systems
[3-0-0:3]
Basic layer model for computer communications; physical signal space and digital
modulation concepts; M-ary modulation, CDMA and OFDM; TCP/IP and related
protocols; local area networks; unicast and multicast routing; QoS; mobile IP; security.
EESM 515
IP Networks
[3-0-0:3]
Designed for students with or without background in computer networks, this course
covers the basic layer model for computer communications, TCP/IP and related
protocols, local area networks, and advanced topics in unicast and multicast routing,
QoS, mobile IP, and security.
EESM 516
Digital VLSI System Design and Design Automation
[3-0-0:3]
Structured design styles, specification, synthesis and simulation using hardware
descriptive language (HDL), structural chip design and system design, circuit design of
system building blocks: arithmetic unit, memory systems, clocking and performance
issues in system design, design-automation tools and their applications, introduction
to testing. Exclusion: ELEC 516
EESM 517
Introduction to Integrated Circuit Testing
[3-0-0:3]
Manufacturing test principles, design strategies for test, chip-level test techniques,
system-level test techniques, layout design for improved testability, practical engineering
techniques for IC testing.
EESM 518
VLSI Signal Processing Architecture
[3-0-0:3]
VLSI architecture design for digital signal processing applications such as multimedia
and communication systems will be covered; general techniques such as pipelining,
retiming, folding and unfolding, and systolic array design will be discussed; algorithmic/
architectural tradeoff in power and performance will be studied; example applications
in video processing and wireless communication architectures will be provided.
Background: ELEC 516 or EESM 516
EESM 520
Telecommunication Regulations, Markets, and Services
[3-0-0:3]
Deregulations in US, Europe, Hong Kong, and China; historical perspectives; market
stratification and players; technologies and business models; E-commerce and security;
Cyberlaw; case studies.
EESM 525
Flat Panel Displays
[3-0-0-:3]
Discussions on various flat-panel display technologies. Emphasis will be placed on
liquid crystal displays. Liquid crystal alignment and optics. Driving methods. Active
matrix. Bistable displays. Plasma display panels. Inorganic and organic light emitting
diodes physics and devices. Exclusion: ELEC 525
EESM 526
Design and Analysis of Engineering Experiments
[3-0-0:3]
Fundamental principles of planning, designing, and analysing statistical experiments.
Probability distributions, tests of hypotheses, analysis of variance, and the applications
using randomized block, factorial, and fractional factorial experimental designs.
Background: MATH 244 Exclusion: IEEM 526
EESM 531
Total Quality Management
[3-0-0:3]
Strategic importance and economic impacts of quality, managerial issues in planning
and designing quality assurance systems, control of quality systems, employee
involvement, statistical concepts in design for quality, inspection, process control, and
ISO 9000. Exclusion: IEEM 531
EESM 532
Image and Video Signal Processing
[3-0-0:3]
Multi-dimensional signals and systems; Characteristics of image and video signals;
visual perception; multi-dimensional sampling and transforms; image and video
enhancement and restoration; image and video compression; coding standards; delivery
of visual contents over networks.
EESM 534
Signal Analysis and Pattern Recognition
[3-0-0:3]
Computer-based interpretation of signals; temporal, frequency, and wavelet analysis;
fractal analysis; object segmentation; data fusion; pattern recognition; density estimation;
feature selection and extraction; clustering; dynamic time warping; hidden Markov
models; examples from biomedical signal processing and speech recognition.
EESM 536
Digital Communications
[3-0-0:3]
This course provides a comprehensive coverage of digital communication theory and
design. Emphasis placed on system goals and trade-offs. Review of signals and
systems, probability and stochastic processes; optimal detection of signals in noise;
basic information theory concepts; coding; basic and advanced digital modulation
schemes; signaling through band-limited and wireless channels; spread-spectrum
communications. Background: Probability theory Exclusion: ELEC 536
EESM 539
Broadband Communication Networks
[3-0-0:3]
Systems and protocols for wireless and high-speed communication networks; from
cellular to wireless IP applications, broadband access technologies; performance
analysis, core network, packet data protocols. Background: ELEC 537 Exclusion:
ELEC 539
EESM 540
Introduction to Telecommunication Networks
[3-0-0:3]
Telecommunication network structures, telephony, SS7, PDH and SDH transmission
systems, network control and signaling, IN and network services, optical and DWDM
networks, from ATM to new IP.
EESM 546
Wireless Communication Systems
[3-0-0:3]
Overview of cellular structure and frequency reuse; mobile radio propagation and path
loss models; statistical nature of radio channels; coding and time or frequency diversity;
spread spectrum CDMA techniques and 3G Systems; OFDM and Wireless LAN
standards; fast frequency hopping technology and Bluetooth. Background: ELEC 343
or equivalent Exclusion: ELEC 546
EESM 547
Multimedia Signal Processing
[3-0-0:3]
Basic signal processing theory, image and video characteristics and processing,
compression techniques, entropy coding, predictive coding, transform coding, vector
quantization, subband coding, audio and speech processing, coding standards, real-
time processing, watermarking, digital rights management.
EESM 560
Thin Film Materials Science
[3-0-0:3]
Basic knowledge of materials science and mechanics of thin films with an emphasis on
the mechanical properties on thin films and failure mechanisms in microelectronic
devices. Exclusions: MATL 560, MECH 504
EESM 570
Feedback Control Theory
[3-0-0:3]
Modeling, analysis, and design of feedback control systems; state space equations
and transfer functions; system simulation; linear and nonlinear system analysis; Lyapunov
stability; feedback controller design; performance specifications; linearization; optimal
control; robotics; computer aided analysis and design.
EESM 581
Advanced Computer and Networking Architectures
[3-0-0:3]
Design and implementation of computer architectures; analysis and comparison of
different architectures; fundamental concepts including pipelining, instruction-level
parallelism, memory hierarchies, input/output architectures, and multiprocessing; modern
issues including networking architecture, storage area networking, and VLSI scaling.
EESM 592
Introduction to Electronic Packaging
[3-0-0:3]
State-of-the-art in IC technology, fundamental packaging architecture, types of package;
packaging materials and processing technologies; functions, geometry, materials and
structure of substrates and PCBs; interconnection technologies; reliability testing and
failure mechanisms of package components; characterization, measurement and failure
analysis; future trends. Exclusions: MATL 540, MECH 592
EESM 690
Independent Study
[3 credits]
Selected topics in electrical and electronic engineering studied under the supervision
of a faculty member.
EESM 691
Topics in Telecommunications and Network
[3-0-0:3]
Convergence
This course integrates the MSc program materials together by covering one or more
selected topics in the following areas: network convergence; multimedia and content
delivery protocols; broadband signaling, and new IP signaling standards; mobile network
and applications; other topics.
EESM 692
Topics in Analog IC Systems and Design
[3-0-0:3]
Selected topics in analog and mixed-signal IC design drawn from disciplines such as
RF/microwave IC design, integrated power electronics, imager design, micro-sensor
design and micro-display design. Two to three selected topics will be discussed in
depth that put emphasis on system level considerations as well as functional blocks
design. Backgrounds: ELEC 304, EESM 503
EESM 698
MSc Project
[2 credits]
Independent project carried out under the supervision of a faculty member. This course
may be run repeatedly for credit(s). Exclusion: ELEC 698