Ansys® Icechip®
ANSYS® Icechip®
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Product Features
ANSYS® Icechip® software allows you to accurately characterize package during
design — saving time, money and headaches that result from discovering thermal
ECAD interfaces
problems late in the design cycle.
Cadence APD
Sigrity UPD
ANSYS Icechip provides far more than temperature predictions typical of other
Package Types
thermal analysis tools. It actually helps build thermal optimization into the design,
Ball grid array
no matter what package style you are designing.
Package-on-package
System-in-package
Leaded
Developed for use by both non-
Stacked die
thermal and thermal analysts, the
Multi-chip modules
ANSYS Icechip direct interface
Flip chip
with industry-recognized package
Wire bond
design tools delivers fast, accu-
Practically any package type
rate results, ensuring the best
ECAD Data Imported
possible thermal design.
Complete ball grid array substrate
• All traces
Improves accuracy: Launch
• All types of vias
• Dielectric and metal layers
ANSYS Icechip from within
• Solderballs
Cadence® APD or Sigrity® UPD
• Bond wires
to capture real device geometry Complex geometry, such as a lead frame, is exactly
• Chips
automatically.
represented in the ANSYS Icechip 3-D model.
• Encapsulant
MCAD Interface through DXF/DWG Files
Reduces time to market: ANSYS Icechip integrates thermal simulation
into the system design and verification process.
Thermal Environment
Natural or forced convection; define a
heat transfer coefficient or have ANSYS
Solid long-term investment: ANSYS Icechip handles today’s package
Icechip calculate
styles as well as the high heat-generating designs of tomorrow.
Radiation
Fixed-temperature boundary conditions
Customer confidence: The ANSYS Icechip library of standard JEDEC
Simulate standard JEDEC thermal, tests
boards and multiple case studies capability means packages can be
characterized based on customers’ real world conditions.
Who Can Use ANSYS Icechip
Electrical and packaging engineers: designed
so you don’t need a strong thermal background
Thermal engineers: generates accurate thermal
models and provides the flexibility to solve
thermal problems
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11 . 0 R E L E A S E
Export the model to ANSYS® or
Automatic 3-D Models
ANSYS® WorkbenchTM for stress
ANSYS Icechip software automatically generates fully
analysis
detailed three-dimensional models. An unstructured
Export the geometry to Icepak® for
triangular mesher is used to capture complex geo-
systems-level simulation
metries such as component lead frames. The substrate
of a ball grid array is three-dimensionally simulated
Define non-uniform power to predict
accounting for every trace, plane and via as a local heat
chip hot spots; power can be
BGA substrate data
temperature dependent
transfer path. Complex algorithms process the exact
imported from Cadence
geometry imported from the ECAD tool and locally
Accurate 3-D models automatically
Allegro Package Designer
represent it at the meshed element level. This method-
generated
ology results in an accurate simulation that can still be
Fast solve times, usually in minutes
solved in minutes. An imported JEDEC board library file
is similarly three-dimensionally represented. This
Includes a library of standard JEDEC
boards
results in accuracies of better than 10 percent of
standard JEDEC Theta-JA simulations when compared
with test data.
Benefits
Thermally design components quickly and
accurately
Work easily and intuitively
Automatically produce detailed 3-D models
Flexibility to simulate today’s complex packages —
Package-on-package
as well as tomorrow’s
simulating a standard JEDEC
Theta-JA thermal test
Package-on-package cross section showing temperatures
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Image Credits: Some images courtesy Aavid Thermalloy, ICT Prague and Silesian University of Technology—Institute of Thermal Technology.
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